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Mold design
7. Mold design 7.6 Temperature control Since mold temperature greatly affects the molding cycle, molded product quality, etc., the temperature control method should carefully be considered in advance as in the case of mold structures including runners, gates, ejector systems, etc. In designing mold temperature control, the following points should be considered.
(a) Heat-transfer area of temperature control holes should be sufficient. (Cooling holes should be large enough in size and number). (b) Temperature control holes should be as close to cavity as possible. (If cooling holes are far from cavity, surface temperature distribution of mold becomes large.) (c) Amount of medium circulated should be sufficient. (A temperature controller, having discharge pressure that can overcome pressure loss at the cooling holes, the discharge rate of which is high, should be used.) (d) Connections should be made in series without split flows wherever possible.
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