Table 1. LAPEROS® LCP low dielectric grade properties |
| Item | Unit | Measurement method |
E420P | E425P* | S420P* | S110P* | E130G | E473i | ||||
| Characteristic | Low dielectric | Low dielectric Low warpage |
Low dielectric High heat resistance Low warpage |
Low dielectric High flow High heat resistance |
SMT standard | SMT Low warpage | ||||||
| ISO (JIS) Marking Code | ISO11469 | >LCP-(GB+MD)20< | >LCP-(GB+MD)25< | >LCP-(GB+MD)20< | >LCP-GB10< | >LCP-GF30< | >LCP-(MD+GF)30< | |||||
| (JIS K6999) | ||||||||||||
| Density | g/cm3 | ISO 1183 | 1.32 | 1.36 | 1.38 | 1.24 | 1.61 | 1.63 | ||||
| Flexural strength | MPa | ISO 178 | 115 | 130 | 140 | 120 | 170 | 160 | ||||
| Flexural modulus | MPa | ISO 178 | 8,000 | 9,000 | 7,700 | 6,500 | 12,000 | 11,000 | ||||
| Flexural strain | % | ISO 178 | 3.2 | 3.0 | 3.6 | 3.3 | 4.2 | 2.8 | ||||
| Temperature of deflection under load (1.8MPa) | ℃ | ISO 75-1,2 | 230 | 230 | 280 | 275 | 245 | 250 | ||||
|
Cavity resonator perturbation method |
3.2 | 3.3 | 3.3 | 3.1 | 4.1 | 4.0 | |||||
| 2.7 | 2.9 | 2.7 | 2.6 | 3.5 | 3.4 | |||||||
|
Cavity resonator perturbation method |
0.002 | 0.004 | 0.002 | 0.002 | 0.006 | 0.005 | |||||
| 0.002 | 0.005 | 0.002 | 0.003 | 0.004 | 0.005 | |||||||
| Low warpage 80-mm flat plate surface flatness (holding pressure : 60MPa) |
mm | Our standard | 1.5 | 0.2 | 0.4 | 5.8 | 5.2 | 0.3 | ||||
| Flowability Minimum packing pressure for connector |
MPa | Our standard | 81 | 71 | 66 | 58 | 82 | 66 | ||||
| * Planned release grade |