|
Defect phenomenon
|
Causes
|
Measures
|
| (1) Flow mark |
|
(1)
|
Residual jetting pattern
on the surface generated when the resin passes through
the gate |
|
Primary measure : Prevent jetting.
|
(1)
|
Make initial running rate
at the gate slow. |
|
(2)
|
Enlarge the gate. |
|
(3)
|
Change the resin to a higher
flow grade. |
|
(4)
|
Elevate resin temperature. |
|
Secondary measure : Prevent jetting
pattern if jetting is generated.
|
(5)
|
Elevate the mold temperature.
Increase holding pressure. |
|
(6)
|
After the gate position
(Make straight length short after resin passes through
the gate). |
| a) |
After the gate position
to the section where flow comes in contact with the core. |
| b) |
Move the gate position to
a thin wall section. |
| c) |
Use a tub gate. |
|
|
(2)
|
Residual flow pattern on
the surface due to flow rate change, generated when the
resin passes corner sections or sections of nonuniform
wall thickness (this wall
thick wall) |
|
|
(1)
|
Make comers rounded. |
|
(2)
|
Make sections where wall
thickness changes gently inclined and rounded. |
|
|
(3)
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Insufficient degassing
|
|
|
(1)
|
Enlarge the gas vent.
|
|
|
|
|
(1)
|
Insufficient adhesion of
resin to cavity due to lack of inner pressure in cavity.
|
|
|
(1)
|
Increase the holding pressure
and hold time. |
|
(2)
|
Enlarge runners and gates. |
|
(3)
|
Raise mold temperature.
Raise material temperature. |
|
(4)
|
Increase injection speed. |
|
|
(2)
|
Insufficient degassing |
|
|
(1)
|
Enlarge the gas vent. |
|
(2)
|
Do not elevate resin temperature
too high. |
|
(3)
|
Dry the material sufficiently. |
|
| (3) Weld mark |
|
(1)
|
Insufficient melting adhesion
of flow front |
|
|
(1)
|
Raise the mold temperature
(buried cartridge heaters in weld sections). |
|
(2)
|
Increase injection speed. |
|
(3)
|
Change the resin to a higher
flow grade. |
|
(4)
|
Enlarge the gas vent in
welds. |
|
(5)
|
Provide weld escape. |
|
(6)
|
Change flow pattern into
welds by adjustment of thickness. |
|
| (4) Silver mark |
|
(1)
|
Volatile components such
as moisture and decomposed gas and air entrapped in plasticization. |
|
(2)
|
Air pocket occurrence by
unbalanced flow in cavity. |
|
|
(1)
|
Dry the material sufficiently
(100 or
higher) |
|
(2)
|
Do not raise the resin temperature
to high. |
|
(3)
|
Increase screw back pressure. |
|
(4)
|
Enlarge gas vent. |
|
(5)
|
Degas from runners. |
|
|
(3)
|
Contamination of foreign
materials such as PE,PP. |
|
|
(1)
|
Purge sufficiently from the cylinder.
|
|
|
Defect phenomenon
|
Causes
|
Measures
|
| (5) Sink mark |
| (1) |
Surface sink with shrinkage
of inner part due to insufficient cooling of thick wall
and rib section and insufficient inner pressure in the
cavity. |
|
| (1) |
Lower the mold temperature. |
| (2) |
Enlarge sprue, runners,
and gates. |
| (3) |
Raise holding pressure.
Prolong holding time. |
| (4) |
Keep cushion amount of material
until gate seal. |
| (5) |
Minimize the rib thickness
to approximately one-third of the base thickness. |
| (6) |
Decrease the thickness of
thick wall sections. |
|
|
|
| (1) |
Contamination of foreign
materials such as PE,PP. |
|
| (1) |
Sufficiently purge the material
from the cylinder. |
|
|
|
| (1) |
Raise the mold temperature. |
| (2) |
Lower the injection speed. |
| (3) |
Enlarge gates. |
|
| (3) |
Separation of oil from oil
filled grades |
|
| (1) |
Decrease initial gate passing
speed. |
| (2) |
Prevent air trapping by
poor feeding through screw during plasticization (control
of cylinder temperature) |
|
|
|
|
| (1) |
Measures against mold deposit |
| |
a) |
Sufficiently dry the material
(100 or
higher). |
| b) |
Do not raise material temperature
too high. |
| c) |
Enlarge gas vent. |
| d) |
Raise mold temperature. |
| (2) |
Cleaning cavities |
| |
a) |
Ultrasonic cleaning of core
in a solvent. |
|
| (2) |
Insufficient adhesion to
cavity |
|
| (1) |
Raise mold temperature.
Increase injection speed. |
| (2) |
Increase holding pressure.
Extend holding time. |
| (3) |
Enlarge sprue, gates, runners. |
| (4) |
Enlarge gas vent grooves. |
|
| (8) Vacuum void |
| (1) |
Inner molten resin is pulled
to surface due to fast solidification of surface layer,
then voids are occurred in inner section. |
|
| (1) |
Locate the gate at the thickest
section of molding. |
| (2) |
Enlarge gate, runner, sprue,
and nozzle in an accordance with thickness of molding.
Increase gate thickness to more than 50%-60% of wall thickness
of molding. |
| (3) |
Increase holding pressure.
Prolong holding time. Keep cushion until gate seal. |
| (4) |
Ensure working of non-return
valve does not cause back flow during holding time. |
| (5) |
Decrease injection speed. |
| (6) |
Change the material to high
viscosity grade. |
|