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 Molded Interconnect Device |
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MID is the abbreviation for "Molded Interconnect Device." It is a three-dimensional electrical circuit on the surface of a plastic mold. The most important feature of MID is the integration of an electrical component (circuit) and a mechanical component (plastic mold), while other main features include miniaturization of components, enhancement of performance and reduction in the number of required components and man-hours for assembly. Primary manufacturing methods for MID in practical use are broadly divided into "one-shot process" and "two-shot process" depending on how many times the injection molding operation is performed in that process. Of each process, the following are known as typical ones: |
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| One-shot process | |||||||||||||||||||||||||||||
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As a process of the UV exposure method, three types (subtractive process, semi-additive process, additive process) are conceivable. The overview processes of the practical two of three are as shown below. |
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| (1) Subtractive process | |||||||||||||||||||||||||||||
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(2) Semi-additive process |
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| This method features circuit formation by forming patterns with a laser beam after forming a metallic thin film on the plastic molded part. |
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| The following are product examples by the laser imaging method: |
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| This method features circuit formation by directly bonding a conductor (foil) onto the plastic molded part using a stamping die. |
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| The following are product examples by the IVONDING method: |
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| In this method, double molding is performed using two dies. It is characterized by a catalyst being applied to the plastic surface after the 1st molding and then the patterns comprised of the plating deposition and non-deposition portions are formed by the 2nd molding before the final formation of the conductive circuit by plating. |
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| The following are product examples by the SKW method: |
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The MID manufacturing methods were briefly introduced above. For more information on MID, visit the website of the Japan MID Association. |
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UV exposure
